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Google is seeking a Silicon Failure Analysis Lead to join their hardware team, focusing on custom silicon solutions for direct-to-consumer products. This role is for an experienced individual who will lead failure analysis efforts for SoC technologies, collaborating with cross-functional teams to identify root causes of failures and ensure product quality and reliability. The ideal candidate will have a strong background in semiconductor failure analysis, including electrical and physical analysis techniques, and experience with ATE and DFT tools.
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of Google's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As Silicon Failure Analysis Lead, you will help integrate SOC technologies into mobile phones, tablets and laptops. You will work with different product disciplines (Design, Product, Test, Process Technology, Yield, Quality and Reliability) to accurately determine the root cause of failures, with the aim of developing advanced, high quality, cost effective and reliable Individual Contributor (ICs).
The Failure Analysis (FA) lead will be responsible for all aspects of failure analysis with respect to Silicon Quality and Reliability Engineering activities, engaging in debug activities from the silicon to the entire package. As a technical leader, you will collaborate with cross-functional teams to drive end-to-end Failure Analysis for yield, reliability and field failures. You will have experience in all aspects of failure analysis: ATE and system level testing, diagnostics, Design for Test (ATPG/MBIST), curve tracing, non-destructive analysis (3D X-ray, CSAM, optical inspection), sample preparation, Electrical FA (Photon/Thermal Emission and Laser-based techniques) and Physical Failure Analysis.
